CYP15G0101DXA-BBC
vs
CYP15G0101DXB-BBXI
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA-100
|
BGA-100
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
1500000 Mbps
|
1500000 Mbps
|
| JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
| JESD-609 Code |
e0
|
e1
|
| Length |
11 mm
|
11 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA100,10X10,40
|
BGA100,10X10,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Supply Current-Max |
0.305 mA
|
0.51 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
11 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
5A991.B.1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare CYP15G0101DXA-BBC with alternatives
Compare CYP15G0101DXB-BBXI with alternatives