CYP15G0401DX-BGC
vs
CYP15G0401TB-BGI
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
27 X 27 MM, 1.52 MM HEIGHT, THERMALLY ENHANCED, BGA-256
|
27 X 27 MM, 1.57 MM HEIGHT, TBGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
not_compliant
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
27 mm
|
27 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.745 mm
|
1.745 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
NOT SPECIFIED
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare CYP15G0401TB-BGI with alternatives