CYP15G0401DX-BGI
vs
CYP15G0401TB-BGC
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA-256
|
27 X 27 MM, 1.57 MM HEIGHT, TBGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
27 mm
|
27 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
1.745 mm
|
1.745 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
NOT SPECIFIED
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare CYP15G0401DX-BGI with alternatives