CYP15G0401RB-BGXC
vs
CYP15G0401DXA-BGI
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
HLBGA, BGA256,20X20,50
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
not_compliant
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
e0
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
NOT SPECIFIED
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
HLBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.745 mm
|
1.7 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Telecom IC Type |
TELECOM CIRCUIT
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
2
|
1
|
HTS Code |
|
8542.39.00.01
|
Data Rate |
|
1500000 Mbps
|
Number of Transceivers |
|
4
|
Package Equivalence Code |
|
BGA256,20X20,50
|
|
|
|
Compare CYP15G0401DXA-BGI with alternatives