DAC08HQ
vs
DAC08EP
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DIP
|
|
| Package Description |
CERDIP-16
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog Output Voltage-Max |
18 V
|
|
| Analog Output Voltage-Min |
-10 V
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY, OFFSET BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.05 mm
|
|
| Linearity Error-Max (EL) |
0.1%
|
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
|
| Negative Supply Voltage-Nom |
-15 V
|
-15 V
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Settling Time-Nom (tstl) |
0.085 µs
|
|
| Supply Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
5
|
5
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIP16,.3
|
| Technology |
|
BIPOLAR
|
|
|
|
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