DB9-USB-D3-F
vs
DB9-USB-D5-F
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
| Part Package Code |
DMA
|
DMA
|
| Package Description |
,
|
,
|
| Pin Count |
9
|
9
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
FTDI Chip
|
FTDI Chip
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
USB
|
USB
|
| Data Transfer Rate-Max |
0.375 MBps
|
0.375 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-XDMA-P9
|
R-XDMA-P9
|
| Low Power Mode |
NO
|
NO
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.25 V
|
4.25 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DB9-USB-D3-F with alternatives
Compare DB9-USB-D5-F with alternatives