DG413LDY-T1-E3
vs
ADG408BRUZ
feature comparison
| Pbfree Code |
|
No
|
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Active
|
| Ihs Manufacturer |
|
ANALOG DEVICES INC
|
| Part Package Code |
|
TSSOP
|
| Package Description |
|
LEAD FREE, MO-153AB, TSSOP-16
|
| Pin Count |
|
16
|
| Manufacturer Package Code |
|
RU-16
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Additional Feature |
|
CAN ALSO OPERATE WITH 12V SUPPLY
|
| Analog IC - Other Type |
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
|
R-PDSO-G16
|
| JESD-609 Code |
|
e3
|
| Length |
|
5 mm
|
| Moisture Sensitivity Level |
|
1
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Channels |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
16
|
| Off-state Isolation-Nom |
|
75 dB
|
| On-state Resistance Match-Nom |
|
15 Ω
|
| On-state Resistance-Max (Ron) |
|
100 Ω
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Signal Current-Max |
|
0.02 A
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Surface Mount |
|
YES
|
| Switch-off Time-Max |
|
150 ns
|
| Switch-on Time-Max |
|
150 ns
|
| Switching |
|
BREAK-BEFORE-MAKE
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
4.4 mm
|
| Base Number Matches |
|
3
|
|
|
|
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