DG419DY+T
vs
DG419C/D-T
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
SOIC
|
DIE
|
Package Description |
SOP, SOP8,.25
|
DIE,
|
Pin Count |
8
|
9
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-PDSO-G8
|
R-XUUC-N9
|
JESD-609 Code |
e3
|
e0
|
Length |
4.9 mm
|
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
9
|
Off-state Isolation-Nom |
68 dB
|
68 dB
|
On-state Resistance Match-Nom |
3 Ω
|
3 Ω
|
On-state Resistance-Max (Ron) |
35 Ω
|
35 Ω
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
DIE
|
Package Equivalence Code |
SOP8,.25
|
DIE OR CHIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
175 ns
|
175 ns
|
Switch-on Time-Max |
175 ns
|
175 ns
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
|
Base Number Matches |
2
|
1
|
Neg Supply Voltage-Max (Vsup) |
|
-20 V
|
Neg Supply Voltage-Min (Vsup) |
|
-4.5 V
|
Supply Voltage-Max (Vsup) |
|
20 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
|
|
|
Compare DG419DY+T with alternatives
Compare DG419C/D-T with alternatives