DM54LS373J vs 74HCT374D/T3 feature comparison

DM54LS373J National Semiconductor Corporation

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74HCT374D/T3 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description CERAMIC, DIP-20 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HCT
JESD-30 Code R-GDIP-T20 R-PDSO-G20
JESD-609 Code e0 e4
Length 24.51 mm 12.8 mm
Load Capacitance (CL) 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.012 A
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 40 mA
Prop. Delay@Nom-Sup 18 ns
Propagation Delay (tpd) 27 ns 48 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.65 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.5 mm
Base Number Matches 4 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 20
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare DM54LS373J with alternatives

Compare 74HCT374D/T3 with alternatives