DM74AS760WM vs 935270794157 feature comparison

DM74AS760WM Texas Instruments

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935270794157 NXP Semiconductors

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code SOIC BGA
Package Description SOP, SOP20,.4 VFBGA,
Pin Count 20 56
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
Family AS LVT
JESD-30 Code R-PDSO-G20 R-PBGA-B56
JESD-609 Code e0
Length 12.8 mm 7 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A
Number of Bits 4 1
Number of Functions 2 16
Number of Ports 2 2
Number of Terminals 20 56
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Characteristics OPEN-COLLECTOR 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP VFBGA
Package Equivalence Code SOP20,.4 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Power Supply Current-Max (ICC) 94 mA
Prop. Delay@Nom-Sup 18.5 ns
Propagation Delay (tpd) 7 ns 4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology TTL BICMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL BOTTOM
Width 7.5 mm 4.5 mm
Base Number Matches 2 1
Manufacturer Package Code SOT-702-1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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