DM74LS191MX
vs
M38510/31509B2C
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
LANSDALE SEMICONDUCTOR INC
|
| Package Description |
SOP, SOP16,.25
|
QCCN, LCC20,.35SQ
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-PDSO-G16
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
20000000 Hz
|
18000000 Hz
|
| Max I(ol) |
0.008 A
|
0.004 A
|
| Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Equivalence Code |
SOP16,.25
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Packing Method |
TR
|
|
| Power Supply Current-Max (ICC) |
35 mA
|
35 mA
|
| Propagation Delay (tpd) |
45 ns
|
66 ns
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
20
|
| Screening Level |
|
MIL-PRF-38535 Class B
|
| fmax-Min |
|
18 MHz
|
|
|
|
Compare DM74LS191MX with alternatives
Compare M38510/31509B2C with alternatives