DN5Q24TTEB
vs
PACDN005Q/R
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
KOA SPEER ELECTRONICS INC
|
CALIFORNIA MICRO DEVICES CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SSOP,
|
SSOP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
KOA Speer
|
|
| Differential Output |
NO
|
NO
|
| Interface IC Type |
DIODE BUS TERMINATION ARRAY
|
DIODE BUS TERMINATION ARRAY
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e3
|
|
| Length |
8.66 mm
|
8.645 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Signal Lines |
18
|
18
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
155 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.8 mm
|
1.75 mm
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Width |
5.99 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Supply Voltage-Nom |
|
5 V
|
|
|
|
Compare DN5Q24TTEB with alternatives
Compare PACDN005Q/R with alternatives