DP83223MDCT
vs
AM7961DCB
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ADVANCED MICRO DEVICES INC
|
Package Description |
DIE,
|
DIP, DIP28,.6
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
X-XUUC-N28
|
R-CDIP-T28
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIE
|
DIP
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Part Package Code |
|
DIP
|
Pin Count |
|
28
|
JESD-609 Code |
|
e0
|
Length |
|
37.1475 mm
|
Number of Transceivers |
|
1
|
Package Equivalence Code |
|
DIP28,.6
|
Seated Height-Max |
|
5.588 mm
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
15.24 mm
|
|
|
|
Compare DP83223MDCT with alternatives
Compare AM7961DCB with alternatives