DP83223MDCT vs MN86961APF-G feature comparison

DP83223MDCT National Semiconductor Corporation

Buy Now Datasheet

MN86961APF-G FUJITSU Limited

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP FUJITSU LTD
Package Description DIE, QFP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code X-XUUC-N28 S-PQFP-G48
Number of Functions 1 1
Number of Terminals 28 48
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE QFP
Package Shape UNSPECIFIED SQUARE
Package Style UNCASED CHIP FLATPACK
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER QUAD
Base Number Matches 1 1
Part Package Code QFP
Pin Count 48
Length 12 mm
Seated Height-Max 2.7 mm
Technology CMOS
Terminal Pitch 0.8 mm
Width 12 mm

Compare DP83223MDCT with alternatives

Compare MN86961APF-G with alternatives