DS1500WE+
vs
DS1500WEN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
TSOP
|
|
| Package Description |
8 X 20 MM, ROHS COMPLIANT, TSOP-32
|
TSOP-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8473.30.11.80
|
|
| Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
| External Data Bus Width |
8
|
8
|
| Information Access Method |
PARALLEL, DIRECT ADDRESS
|
PARALLEL, DIRECT ADDRESS
|
| Interrupt Capability |
Y
|
Y
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| JESD-609 Code |
e3
|
e0
|
| Length |
18.4 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
32
|
32
|
| Number of Timers |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP32,.8,20
|
TSSOP32,.8,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.24 mm
|
|
| Supply Voltage-Max |
3.6 V
|
3.63 V
|
| Supply Voltage-Min |
2.97 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time-Min |
SECONDS
|
SECONDS
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Volatile |
NO
|
NO
|
| Width |
8 mm
|
|
| uPs/uCs/Peripheral ICs Type |
TIMER, REAL TIME CLOCK
|
TIMER, REAL TIME CLOCK
|
| Base Number Matches |
1
|
2
|
|
|
|
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