DS2141
vs
MH89760B
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
DALLAS SEMICONDUCTOR
|
ZARLINK SEMICONDUCTOR INC
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
HYBRID
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Package Description |
|
DIP, DIP40,1.3
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e0
|
| Length |
|
50.8 mm
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP40,1.3
|
| Supply Current-Max |
|
25 mA
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
33 mm
|
|
|
|
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