DS2155GNB+
vs
DS2155GB
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
10 X 10 MM, ROHS COMPLIANT, CSBGA-100
|
10 X 10 MM, CSBGA-100
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
4 Weeks
|
| Carrier Type |
CEPT PCM-30/E-1
|
CEPT PCM-30/E-1
|
| Carrier Type (2) |
T-1(DS1)
|
T-1(DS1)
|
| JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
| JESD-609 Code |
e1
|
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA100,10X10,32
|
BGA100,10X10,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare DS2155GNB+ with alternatives
Compare DS2155GB with alternatives