DS2176+
vs
LXP2176NE
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
LEVEL ONE
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, DIP-24
|
DIP, DIP24,.3
|
| Pin Count |
24
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Carrier Type |
CEPT PCM-30/E-1
|
CEPT PCM-30/E-1
|
| Carrier Type (2) |
T-1(DS1)
|
T-1(DS1)
|
| Data Rate |
2048 Mbps
|
2048 Mbps
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDIP-T24
|
| JESD-609 Code |
e3
|
e0
|
| Length |
30.545 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Current-Max |
10 mA
|
10 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
ELASTIC BUFFER
|
ELASTIC BUFFER
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
8
|
1
|
|
|
|
Compare DS2176+ with alternatives
Compare LXP2176NE with alternatives