DS26401N+
vs
TXC-03108AIBG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TRANSWITCH CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Package Description |
|
BGA, BGA256,20X20,50
|
| Pin Count |
|
256
|
| JESD-30 Code |
|
S-PBGA-B256
|
| Length |
|
27 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
256
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA256,20X20,50
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.32 mm
|
| Supply Current-Max |
|
140 mA
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
27 mm
|
|
|
|
Compare DS26401N+ with alternatives
Compare TXC-03108AIBG with alternatives