DS26514GN+
vs
DS21458
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Part Package Code |
256-CSP_BGA-17X17X1.26
|
BGA
|
Pin Count |
256
|
256
|
Manufacturer Package Code |
256-CSP_BGA-17X17X1.26
|
|
Date Of Intro |
2008-10-20
|
|
Samacsys Manufacturer |
Analog Devices
|
|
Carrier Type |
CEPT PCM-30/E-1
|
|
Carrier Type (2) |
T-1(DS1)
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.76 mm
|
1.5 mm
|
Supply Current-Max |
250 mA
|
|
Supply Voltage-Nom |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
7
|
Pbfree Code |
|
No
|
Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
|
17 X 17 MM, 1 MM PITCH, CSBGA-256
|
Reach Compliance Code |
|
not_compliant
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Technology |
|
BIPOLAR
|
|
|
|
Compare DS26514GN+ with alternatives
Compare DS21458 with alternatives