DS26LS32CN
vs
AM26LS32BCN
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
PHILIPS SEMICONDUCTORS
|
Package Description |
,
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
Base Number Matches |
3
|
3
|
Rohs Code |
|
No
|
JESD-30 Code |
|
R-PDIP-T16
|
JESD-609 Code |
|
e0
|
Number of Terminals |
|
16
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Output Low Current-Max |
|
0.024 A
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP16,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Qualification Status |
|
Not Qualified
|
Receive Delay-Max |
|
26 ns
|
Supply Current-Max |
|
70 mA
|
Supply Voltage-Nom |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
TTL
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
|
|
|