DS26LV31W-QML
vs
5962-9858401QFX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
CERAMIC, DFP-16
|
DFP,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| High Level Input Current-Max |
0.00001 A
|
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-422-B; TIA-422-B; V.11
|
GENERAL PURPOSE
|
| JESD-30 Code |
R-GDFP-F16
|
R-GDFP-F16
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Out Swing-Min |
2 V
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Screening Level |
MIL-PRF-38535 Class Q
|
|
| Seated Height-Max |
2.032 mm
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Transmit Delay-Max |
25 ns
|
25 ns
|
| Width |
6.35 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DS26LV31W-QML with alternatives
Compare 5962-9858401QFX with alternatives