DS3134
vs
DS26518GN
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
| Part Package Code |
BGA
|
256-CSP_BGA-17X17X1.26
|
| Package Description |
27 X 27 MM, PLASTIC, BGA-256
|
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
not_compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
|
| Length |
27 mm
|
17 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.34 mm
|
1.76 mm
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
17 mm
|
| Base Number Matches |
1
|
3
|
| Manufacturer Package Code |
|
256-CSP_BGA-17X17X1.26
|
| Date Of Intro |
|
2007-02-28
|
| Carrier Type |
|
CEPT PCM-30/E-1
|
| Carrier Type (2) |
|
T-1(DS1)
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Supply Current-Max |
|
450 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare DS3134 with alternatives
Compare DS26518GN with alternatives