DS31412
vs
DS3148N
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
HBGA, BGA349,19X19,50
|
27 X 27 MM, BGA-349
|
Pin Count |
349
|
349
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
JESD-30 Code |
S-PBGA-B349
|
S-PBGA-B349
|
JESD-609 Code |
e0
|
e0
|
Length |
27 mm
|
27 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
349
|
349
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
HBGA
|
Package Equivalence Code |
BGA349,19X19,50
|
BGA349,19X19,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.35 mm
|
2.35 mm
|
Supply Current-Max |
0.96 mA
|
0.64 mA
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare DS31412 with alternatives
Compare DS3148N with alternatives