DS33X81+
vs
STULPI01BTBR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Part Package Code |
256-CSP_BGA-17X17X1.26
|
BGA
|
| Pin Count |
256
|
36
|
| Manufacturer Package Code |
256-CSP_BGA-17X17X1.26
|
|
| Date Of Intro |
2008-02-04
|
|
| Samacsys Manufacturer |
Analog Devices
|
STMicroelectronics
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B36
|
| JESD-609 Code |
e1
|
e2
|
| Length |
17 mm
|
3.6 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
36
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.77 mm
|
1.16 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
17 mm
|
3.6 mm
|
| Base Number Matches |
1
|
1
|
| Ihs Manufacturer |
|
STMICROELECTRONICS
|
| Package Description |
|
3.6 X 3.6 MM, ROHS COMPLIANT, MICRO TFBGA-36
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
32 Weeks, 4 Days
|
|
|
|
Compare DS33X81+ with alternatives
Compare STULPI01BTBR with alternatives