DS34S132GNA2+
vs
DS34S132GN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
BGA,
|
27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Code |
BGA
|
HBGA
|
| Seated Height-Max |
2.41 mm
|
2.41 mm
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
2
|
4
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
676
|
| JESD-30 Code |
|
S-PBGA-B676
|
| Number of Terminals |
|
676
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Terminal Form |
|
BALL
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare DS34S132GNA2+ with alternatives
Compare DS34S132GN with alternatives