DS90C241QVSX
vs
DS90C241IVSX
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, TQFP-48
|
TFQFP,
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
1
|
24
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
| JESD-609 Code |
e0
|
e0
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
TFQFP
|
| Package Equivalence Code |
TQFP48,.35SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
48
|
| Screening Level |
|
AEC-Q100
|
| Technology |
|
CMOS
|
|
|
|
Compare DS90C241QVSX with alternatives
Compare DS90C241IVSX with alternatives