DS90CF363BMT/NOPB
vs
SN75LVDS85DGG
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
TSSOP-48
|
PLASTIC, SO-48
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-644; TIA-644
|
EIA-644
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| JESD-609 Code |
e3
|
e0
|
| Length |
12.5 mm
|
12.5 mm
|
| Moisture Sensitivity Level |
2
|
NOT SPECIFIED
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-10 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP48,.3,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Receive Delay-Max |
|
|
| Seated Height-Max |
1.1 mm
|
1.2 mm
|
| Supply Current-Max |
55 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
6.1 mm
|
6.1 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
48
|
|
|
|
Compare DS90CF363BMT/NOPB with alternatives
Compare SN75LVDS85DGG with alternatives