DS90CR286MTDX vs DS90CF386SLCX/NOPB feature comparison

DS90CR286MTDX National Semiconductor Corporation

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DS90CF386SLCX/NOPB National Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description LOW PROFILE, PLASTIC, TSSOP-56 0.80 MM PITCH, FBGA-64
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output NO
Input Characteristics DIFFERENTIAL DIFFERENTIAL
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard GENERAL PURPOSE EIA-644; TIA-644
JESD-30 Code R-PDSO-G56 S-PBGA-B64
JESD-609 Code e0 e1
Length 14 mm 8 mm
Moisture Sensitivity Level 2 4
Number of Functions 4 4
Number of Terminals 56 64
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C -10 °C
Output Characteristics TOTEM-POLE
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LFBGA
Package Equivalence Code TSSOP56,.3,20 BGA64,8X8,32
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 235 260
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Receiver Number of Bits 4 4
Seated Height-Max 1.2 mm 1.5 mm
Supply Current-Max 105 mA 135 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 6.1 mm 8 mm
Base Number Matches 2 1

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Compare DS90CF386SLCX/NOPB with alternatives