DS90LV018AMDC
vs
DS90LV018ATM/NOPB
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
DIE, DIE OR CHIP
|
0.150 INCH, PLASTIC, SOIC-8
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
Interface Standard |
EIA-644; TIA-644
|
EIA-644; TIA-644
|
JESD-30 Code |
X-XUUC-N
|
R-PDSO-G8
|
Number of Functions |
1
|
1
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Low Current-Max |
0.002 A
|
0.002 A
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
SOP
|
Package Equivalence Code |
DIE OR CHIP
|
SOP8,.25
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
2.5 ns
|
2.5 ns
|
Receiver Number of Bits |
1
|
1
|
Supply Current-Max |
9 mA
|
9 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Length |
|
4.9 mm
|
Moisture Sensitivity Level |
|
1
|
Number of Terminals |
|
8
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.75 mm
|
Terminal Finish |
|
Matte Tin (Sn)
|
Terminal Pitch |
|
1.27 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
3.9 mm
|
|
|
|
Compare DS90LV018AMDC with alternatives
Compare DS90LV018ATM/NOPB with alternatives