DS92LV0411SQENOPB
vs
DS92LV0411SQENOPB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
QCCN, LCC36,.25SQ,20
|
6 X 6 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LLP-36
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
JESD-30 Code |
S-XQCC-N36
|
S-XQCC-N36
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
36
|
36
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
QCCN
|
|
Package Equivalence Code |
LCC36,.25SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
|
|
Supply Current-Max |
90 mA
|
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
QFN
|
Pin Count |
|
36
|
|
|
|
Compare DS92LV0411SQENOPB with alternatives
Compare DS92LV0411SQENOPB with alternatives