DS96F173MJ-SMD vs DS96F174CMWC feature comparison

DS96F173MJ-SMD National Semiconductor Corporation

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DS96F174CMWC Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIE, WAFER
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER STANDARD
Interface IC Type LINE RECEIVER LINE DRIVER
Interface Standard EIA-422-A; EIA-423-A; EIA-485 EIA-422; EIA-485
JESD-30 Code R-GDIP-T16 X-XUUC-N
Length 19.43 mm
Number of Functions 4 4
Number of Terminals 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 30 ns
Receiver Number of Bits 4
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 7.62 mm
Base Number Matches 1 1
Differential Output YES
Driver Number of Bits 4
High Level Input Current-Max 0.00002 A
Out Swing-Min 1.5 V
Package Equivalence Code WAFER
Transmit Delay-Max 16 ns

Compare DS96F173MJ-SMD with alternatives

Compare DS96F174CMWC with alternatives