DS96F174MJ-MLS vs MAX3045BEWE+T feature comparison

DS96F174MJ-MLS National Semiconductor Corporation

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MAX3045BEWE+T Analog Devices Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description DIP,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; EIA-485 EIA-422; EIA-485
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Length 19.43 mm 10.3 mm
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.65 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Transmit Delay-Max 25 ns 1500 ns
Width 7.62 mm 7.5 mm
Base Number Matches 2 2
Rohs Code Yes
Part Package Code 16-SOIC_W-300_MIL
Pin Count 16
Manufacturer Package Code 16-SOIC_W-300_MIL
Date Of Intro 2001-07-15
Samacsys Manufacturer Analog Devices
JESD-609 Code e3
Moisture Sensitivity Level 1
Out Swing-Min 1.5 V
Output Characteristics 3-STATE
Package Equivalence Code SOP16,.4
Peak Reflow Temperature (Cel) 260
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

Compare DS96F174MJ-MLS with alternatives

Compare MAX3045BEWE+T with alternatives