DS96F174MMW8 vs DS96F173MJ feature comparison

DS96F174MMW8 National Semiconductor Corporation

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DS96F173MJ National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description DIE, WAFER DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES
Driver Number of Bits 4
High Level Input Current-Max 0.00002 A
Input Characteristics STANDARD DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE DRIVER LINE RECEIVER
Interface Standard EIA-422; EIA-485 EIA-422-A; EIA-423-A; EIA-485
JESD-30 Code X-XUUC-N R-GDIP-T16
Number of Functions 4 4
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Out Swing-Min 1.5 V
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Equivalence Code WAFER DIP16,.3
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 30 ns
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Transmit Delay-Max 25 ns
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Length 19.43 mm
Number of Terminals 16
Output Low Current-Max 0.016 A
Output Polarity TRUE
Receiver Number of Bits 4
Seated Height-Max 5.08 mm
Supply Current-Max 50 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare DS96F174MMW8 with alternatives

Compare DS96F173MJ with alternatives