DS99R106SQ
vs
LMH0387SL/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
7 X 7 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, LLP-48
|
7 X 7 MM, CSP-48
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
5A991.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
1
|
1
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
LINE RECEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
S-XQCC-N48
|
S-XQCC-N48
|
| JESD-609 Code |
e0
|
e4
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VQCCN
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Qualification Status |
Not Qualified
|
|
| Receive Delay-Max |
|
|
| Receiver Number of Bits |
1
|
1
|
| Seated Height-Max |
0.8 mm
|
0.9 mm
|
| Supply Current-Max |
95 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.465 V
|
| Supply Voltage-Min |
3 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
NICKEL GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare DS99R106SQ with alternatives
Compare LMH0387SL/NOPB with alternatives