DSA2311KA2-R0009TVAO
vs
DSC400-1111Q0111KI2T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
VDFN-6
|
QFN-20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
MEMS CLOCK GENERATORS AS EXT CLOCK
|
|
| JESD-30 Code |
R-PDSO-N6
|
R-XQCC-N20
|
| JESD-609 Code |
e3
|
|
| Length |
2.5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
6
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Clock Frequency-Max |
100 MHz
|
170 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SON
|
HVQCCN
|
| Package Equivalence Code |
SOLCC6,.08,32
|
LCC20,.12X.2,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
AEC-Q100; TS 16949
|
AEC-Q100; MIL-STD-883
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Current-Max |
23 mA
|
44 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.825 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
2 mm
|
3.2 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, MEMS
|
CLOCK GENERATOR, MEMS
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DSA2311KA2-R0009TVAO with alternatives
Compare DSC400-1111Q0111KI2T with alternatives