DSC557-0334FI1T
vs
DSC557-0334FL1T
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFN-14
|
QFN-14
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Additional Feature |
ELIMINATED THE EXT QUARTZ CRYSTAL AND USED MEMS CLOCK GENERATORS AS EXT CLOCK
|
ELIMINATED THE EXT QUARTZ CRYSTAL AND USED MEMS CLOCK GENERATORS AS EXT CLOCK
|
JESD-30 Code |
R-XQCC-N14
|
R-XQCC-N14
|
Length |
3.2 mm
|
3.2 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Clock Frequency-Max |
460 MHz
|
460 MHz
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC14,.1X.12,20
|
LCC14,.1X.12,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Supply Current-Max |
23 mA
|
23 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.25 V
|
2.25 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
2.5 mm
|
2.5 mm
|
uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, MEMS
|
CLOCK GENERATOR, MEMS
|
Base Number Matches |
2
|
2
|
|
|
|
Compare DSC557-0334FI1T with alternatives
Compare DSC557-0334FL1T with alternatives