DV74HC648DW
vs
HD74HC648RP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
AVG SEMICONDUCTORS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
SOP,
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
DIRECTION CONTROL; SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED OR REAL TIME DATA
|
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| Length |
15.4 mm
|
15.8 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
330 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.5 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
8.4 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DV74HC648DW with alternatives
Compare HD74HC648RP with alternatives