Findchips: Compare DV74HCT00AN vs 74HC03DB,112

DV74HCT00AN vs 74HC03DB,112 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	AVG SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	DIP	SSOP1
Package Description	DIP, DIP14(UNSPEC)	SOT-337-1, SSOP-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HCT	HC/UH
JESD-30 Code	R-PDIP-T14	R-PDSO-G14
Length	18.86 mm	6.2 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A	0.004 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	DIP	SSOP
Package Equivalence Code	DIP14(UNSPEC)	SSOP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup	110 ns	29 ns
Propagation Delay (tpd)	28 ns	29 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	NO
Seated Height-Max	4.69 mm	2 mm
Supply Voltage-Max (Vsup)	5.5 V	6 V
Supply Voltage-Min (Vsup)	4.5 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	5.3 mm
Base Number Matches	1	2
Rohs Code		Yes
Manufacturer Package Code		SOT337-1
JESD-609 Code		e4
Moisture Sensitivity Level		1
Output Characteristics		OPEN-DRAIN
Packing Method		BULK
Peak Reflow Temperature (Cel)		260
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates