E-TDA7384A
vs
TDA7564BPD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
ZFM
|
SOIC
|
| Package Description |
FLEXIWATT-25
|
HSSOP, SSOP36,.56
|
| Pin Count |
25
|
36
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
18 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Bandwidth-Nom |
20 kHz
|
22 kHz
|
| Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| Gain |
26 dB
|
26 dB
|
| Harmonic Distortion |
10%
|
10%
|
| JESD-30 Code |
R-XZFM-T25
|
R-PDSO-G36
|
| JESD-609 Code |
e3
|
e3
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
25
|
36
|
| Output Power-Nom |
26 W
|
50 W
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
ZIP
|
HSSOP
|
| Package Equivalence Code |
ZIP25,.16,.16,40
|
SSOP36,.56
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
350 mA
|
300 mA
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BCDMOS
|
| Terminal Finish |
Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.65 mm
|
| Terminal Position |
ZIG-ZAG
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
| Length |
|
15.9 mm
|
| Moisture Sensitivity Level |
|
3
|
| Seated Height-Max |
|
3.41 mm
|
| Supply Voltage-Max (Vsup) |
|
18 V
|
| Supply Voltage-Min (Vsup) |
|
8 V
|
| Width |
|
11 mm
|
|
|
|
Compare E-TDA7384A with alternatives
Compare TDA7564BPD with alternatives