E-TDA8177
vs
TEA8172
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Part Package Code |
ZFM
|
|
| Package Description |
,
|
|
| Pin Count |
7
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Blanking Output |
NO
|
NO
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PZFM-T7
|
R-PZIP-T7
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
7
|
7
|
| Operating Temperature-Max |
75 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
35 V
|
|
| Supply Voltage-Min (Vsup) |
10 V
|
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
ZIG-ZAG
|
ZIG-ZAG
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Code |
|
ZIP
|
| Package Equivalence Code |
|
ZIP7,.2,.1TB
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
1.27 mm
|
|
|
|
Compare E-TDA8177 with alternatives