EL7457CLZ-T7A
vs
EL7457CUZ-T7A
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
QFN, QSOP, SOIC
|
QFN, QSOP, SOIC
|
| Package Description |
HVQCCN, LCC16,.16SQ,25
|
SSOP, SSOP16,.25
|
| Pin Count |
16, 16, 16
|
16, 16, 16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
26 Weeks
|
| Driver Number of Bits |
4
|
4
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
S-XQCC-N16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
4.89 mm
|
| Moisture Sensitivity Level |
3
|
2
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
0.1 A
|
0.1 A
|
| Output Peak Current Limit-Nom |
2 A
|
2 A
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SSOP
|
| Package Equivalence Code |
LCC16,.16SQ,25
|
SSOP16,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.73 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Supply Voltage1-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
|
|
|