EL7457CSZ-T7A
vs
EL7457CL-T13
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Part Package Code |
SOICN
|
QFN
|
| Package Description |
SOP,
|
4 X 4 MM, MO-220, QFN-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
MDP0027
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-10-16
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.9 mm
|
4 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.879 mm
|
1 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.91 mm
|
4 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| Driver Number of Bits |
|
4
|
| Output Current-Max |
|
0.1 A
|
| Output Peak Current Limit-Nom |
|
2 A
|
| Package Equivalence Code |
|
LCC16,.16SQ,25
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage1-Nom |
|
5 V
|
|
|
|
Compare EL7457CSZ-T7A with alternatives
Compare EL7457CL-T13 with alternatives