ENC28J60-I/SP
vs
ENC28J60-I/ML
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
QFN
|
| Package Description |
0.300 INCH, PLASTIC, SPDIP-28
|
6 X 6 MM, PLASTIC, QFN-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
6 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
SPI
|
SPI
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| Communication Protocol |
SYNC, BYTE
|
MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
|
| Data Transfer Rate-Max |
1.25 MBps
|
1.25 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T28
|
S-PQCC-N28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
34.671 mm
|
6 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
28
|
28
|
| On Chip Data RAM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HVQCCN
|
| Package Equivalence Code |
DIP28,.6
|
LCC28,.24SQ,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
8192
|
8192
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
4.572 mm
|
1 mm
|
| Supply Current-Max |
180 mA
|
180 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.1 V
|
3.1 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare ENC28J60-I/SP with alternatives
Compare ENC28J60-I/ML with alternatives