EP1C12F324I7N
vs
EP1C12F324I7N
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
BGA
|
|
Package Description |
FBGA-324
|
FBGA-324
|
Pin Count |
324
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
Intel
|
Clock Frequency-Max |
320 MHz
|
320 MHz
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
JESD-609 Code |
e1
|
e1
|
Length |
19 mm
|
19 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
1206
|
1206
|
Number of Inputs |
249
|
249
|
Number of Logic Cells |
12060
|
12060
|
Number of Outputs |
249
|
249
|
Number of Terminals |
324
|
324
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
1206 CLBS
|
1206 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
245
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
19 mm
|
19 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A991
|
|
|
|
Compare EP1C12F324I7N with alternatives
Compare EP1C12F324I7N with alternatives