EP1S30F780C5 vs EP1S30F780C7 feature comparison

EP1S30F780C5 Intel Corporation

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EP1S30F780C7 Altera Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description BGA, BGA780,28X28,40 29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e0
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3819 3819
Number of Inputs 726 726
Number of Logic Cells 32470 32470
Number of Outputs 726 726
Number of Terminals 780 780
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 3819 CLBS 3819 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 3 3
Pbfree Code No
Part Package Code BGA
Pin Count 780
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20

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