EP1S30F780C8N
vs
EP1S30F780C5N
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
29 X 29 MM, 1 MM PITCH, FBGA-780
|
29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780
|
| Pin Count |
780
|
780
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
| JESD-609 Code |
e1
|
e1
|
| Length |
29 mm
|
29 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
3819
|
3819
|
| Number of Inputs |
726
|
726
|
| Number of Logic Cells |
32470
|
32470
|
| Number of Outputs |
726
|
726
|
| Number of Terminals |
780
|
780
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
3819 CLBS
|
3819 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
BGA
|
| Package Equivalence Code |
BGA780,28X28,40
|
BGA780,28X28,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.5 mm
|
3.5 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
29 mm
|
29 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare EP1S30F780C8N with alternatives
Compare EP1S30F780C5N with alternatives