EP1S60F1508C6ES
vs
EP1S60F1508C7
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
BGA,
|
40 X 40 MM, 1 MM PITCH, FBGA-1508
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B1508
|
S-PBGA-B1508
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
1508
|
1508
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
1508
|
| Length |
|
40 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of CLBs |
|
6570
|
| Number of Inputs |
|
1022
|
| Number of Logic Cells |
|
57120
|
| Number of Outputs |
|
1022
|
| Organization |
|
6570 CLBS
|
| Package Equivalence Code |
|
BGA1508,39X39,40
|
| Peak Reflow Temperature (Cel) |
|
220
|
| Seated Height-Max |
|
3.5 mm
|
| Terminal Pitch |
|
1 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Width |
|
40 mm
|
|
|
|
Compare EP1S60F1508C6ES with alternatives
Compare EP1S60F1508C7 with alternatives