EP20K100EBC356-1XN
vs
EP20K100QC208-2X
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
LBGA,
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B356
|
|
| JESD-609 Code |
e1
|
|
| Length |
35 mm
|
|
| Number of Dedicated Inputs |
4
|
|
| Number of I/O Lines |
246
|
|
| Number of Terminals |
356
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
4 DEDICATED INPUTS, 246 I/O
|
|
| Output Function |
MACROCELL
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Programmable Logic Type |
LOADABLE PLD
|
|
| Propagation Delay |
1.73 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.63 mm
|
|
| Supply Voltage-Max |
1.89 V
|
|
| Supply Voltage-Min |
1.71 V
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
35 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
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