EP20K100FC324-2 vs EP20K100FC324-2V feature comparison

EP20K100FC324-2 Intel Corporation

Buy Now Datasheet

EP20K100FC324-2V Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS INC
Package Description BGA, BGA324(UNSPEC) BGA,
Reach Compliance Code compliant unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e0 e1
Length 19 mm 19 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 252 252
Number of Inputs 246
Number of Logic Cells 4160
Number of Outputs 246
Number of Terminals 324 324
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 252 I/O 4 DEDICATED INPUTS, 252 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324(UNSPEC)
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 3 ns 3 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 324
Clock Frequency-Max 34 MHz

Compare EP20K100FC324-2 with alternatives